Finally, I would like to thank Prof. The two interfacial reactions interact with each other and the interaction is a reliability issue. They are convenient references for analyzing the basic kinetic behaviors of solder joints discussed in this book. King-ning , 1937- Electronic thin film reliability. Beginning with core topics such as deposition and diffusion, the book fully explains irreversible processes with practical examples. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern.
Elastic constants tables and conversions; E. Surface energy in thin films; 4. Zapraszamy do zapoznania się z ofertą podręczników oraz lektur do nauki języka angielskiego Wydawnictwa Cambridge U P. Derivation of Huntington's electron wind force -- D. Defect concentration in solids -- C. Irreversible processes in interconnect and packaging technology; 11.
Electromigration induced failure in Al and Cu interconnects; 13. Stress migration in thin films; 15. As the trend for miniaturization of Electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Solder joints are ubiquitous in electronic products. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners. Atomic diffusion in crystalline solids; 5. The unique failure model due to pancake-type void formation at the cathode contact interface is given.
It is a key chapter of the book. Why it is important and what are the known reliability problems are explained. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Applications of diffusion equation; 6. Chapter 11 describes the interaction between electrical and mechanical forces. Microstructure instability in a eutectic two-phase structure driven by a temperature gradient is addressed I started solder research in 1965, when I began my Ph. Solder Joint Technology: Materials, Properties, and Reliability K.
The future trend in electronic packaging technology and its effect on solder joint technology is given. Reliability science and analysis; Appendices: A. I would like to acknowledge that the last derivation on electron wind force has been taken from the lecture notes of Professor A. Thin films are widely used in the Electronic device industry. Applications of diffusion equation; 6.
Surface energy in thin films; 4. Chapter 12 is about thermomigration in solder joints, and the interaction between electrical and thermal forces is analyzed. Chapter 7 discusses briefly solder reactions on nickel, palladium, and gold surfaces. Thin film reactions are important since most metallization on Si devices to be joined by solder is in thin film form. Cena może ulec zmianie po wycenie.
Typically, metallurgical phase transformations occur under constant temperature and constant pressure so that Gibbs free energy is minimized. Weijia Wen of the Department of Physics, Hong Kong University of Science and Technology for hosting my two-month visit to Hong Kong so that I could concentrate on finishing the final version of the book. To solve these problems in a largely technology based manufacturing industry, scientific understanding and solutions are required. I would like to acknowledge the generous support and to thank these students and post-docs. To manufacture these multi-functional products, high-density circuit interconnections between a Si chip and its substrate are needed. Reliability science and analysis; Appendices: A.
Watson Research Center as a Research Staff Member in the Physical Science Department. The unique morphology of scallop-type Cu-Sn intermetallic compound formation is emphasized and analyzed. Interdiffusion and reaction in thin films; 9. A brief review of thermodynamic functions -- B. Chapter 10 is about the interaction between electrical and chemical forces in solder joints. Elastic constants tables and conversions -- E.
The E-mail message field is required. King-Ning Tu is a Professor in the Department of Materials Science and Engineering at the University of California at Los Angeles. Step-by-step derivation of Huntington's electron wind force; D. The contents of the book are divided into two parts. Gusak at Cherkasy National University, Ukraine. Actually the second theme also emphasizes phase transformations under an inhomogeneous boundary condition.